Inmold offers masters, commonly fabricated in silicon, with micro- and nanostructures designed in collaboration with the customer. We are using deep-UV lithography (DUV) and reactive ion etching to transfer the pattern into silicon or quartz. The wafer may be diced to any shape or size using a laser micromachining tool. An optional anti-adhesion coating may be applied.

Wafer sizes: 50 mm, 100 mm and 150 mm (2”, 4” and 6”)
Minimum lateral dimension: 200 nm
Anti-adhesive coating: Fluorinated monolayer